Advanced Computing in the Age of AI | Wednesday, April 24, 2024

Asetek Announces Global OEM Purchase Agreement with Fujitsu 

Asetek announced today a global purchase agreement with Fujitsu Technology Solutions GmbH, a leading global server vendor. Fujitsu will incorporate Asetek’s RackCDU D2C liquid cooling technology into its High Performance Computing (HPC) server product line. RackCDU enhances Fujitsu’s ability to provide solutions for world-class data center efficiency and reduced operating costs. RackCDU liquid cooling improves data center performance by increasing energy efficiency and server density.

Asetek expects Fujitsu to launch the first products based on RackCDU in the second quarter of 2015, and anticipates product launches involving various server models throughout the year. In 2014, Fujitsu was cited by IDC to be the fourth largest server vendor by revenue.

“This agreement is a significant milestone for Asetek and its stakeholders,” said André Sloth Eriksen, founder and CEO of Asetek. “Our collaboration with Fujitsu ushers in a new stage in the adoption of RackCDU. With its global reach and industry position, Fujitsu is poised to drive adoption of Asetek liquid cooling in data centers worldwide.”

Asetek’s liquid cooling technology provides tangible financial savings for data centers. The typical data center today uses 40% or more of its power for cooling and reducing power consumption is essential to achieving lower data center operating costs. As cited in a study by Lawrence Berkeley National Laboratory, a leading center for energy efficiency research of the US Department of Energy, RackCDU can save over 50% of cooling power and over 21% of total data center energy. Additionally, RackCDU’s ability to increase server density by a factor of 2.5-5x avoids the need for expensive data center build outs.

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