Asetek to Showcase Latest Datacenter Installations at Data Centre World
Asetek will showcase its latest energy saving data center liquid cooling solutions at Data Centre World in London, UK at the ExCeL London Exhibition and Convention Centre – March 11-12, 2015 at booth E55.
Asetek will be highlighting installations that reflect the company’s accelerating market momentum with RackCDU D2C (Direct to Chip) liquid cooling solutions. Featured customers and organizations include the University of Tromsø, Mississippi State University, the U.S. National Renewable Energy Laboratory and Sandia National Laboratories.
“Our recent agreement with Fujitsu to incorporate Asetek’s cooling technology into their HPC servers brings energy reduction and cost savings to data centers across the world,” said David Garcia, VP & GM of Asetek’s Data Center Business Unit. “Data Centre World is the perfect opportunity to showcase our growing list of installations and partners with the European data center community.”
Servers and blades from a variety of server manufactures incorporating Asetek’s technology will be on display. Additionally, vistors can view real-time monitoring of a high-density HPC system incorporating RackCDU D2C in Asetek’s booth.
RackCDU D2C is a “free cooling” solution that captures between 60% and 80% of server heat, reducing data center cooling cost by over 50% and allowing 2.5x-5x increases in data center server density. D2C removes heat from CPUs, GPUs, memory modules within servers using water as hot as 40°C (105°F), eliminating the need for chilling to cool these components.
