packaging
Industry Heavyweights Launch UCIe Consortium to Drive Chiplet Interconnect Standard
A new industry consortium aims to establish a die-to-die interconnect standard – Universal Chiplet Interconnect Express (UCIe) – in support of an open chiplet ecosystem. Intel Corporation donated the ...Full Article
AMD Accelerates Chip Testing With Flash Storage
Like most large enterprises, chip maker AMD has some big central systems that it uses to run its core business, and on top of that, it has a cluster ...Full Article
